lead-free parts pb ligitek electronics co.,ltd. property of ligitek only data sheet L12URF9653S-50B-AM square with 4leads type led lamps doc. no : qw0905-L12URF9653S-50B-AM-b01 rev. : a date : 05 - dec.- 2008
page 1/6 ligitek electronics co.,ltd. property of ligitek only part no. L12URF9653S-50B-AM package dimensions directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 100% 60 -60 25% 75% 100%50% 50% 025%75% -30 30 0 3.5 0.5 anode cathode 7.62 0.5 4.8 0.5 5.08 0.5 5.08 0.3 3.4 7.62 0.5 ? 4.55 r0.7 1.55 2.5 0.5
625 luminous flux @70ma(lm) forward voltage @70ma(v) part no. L12URF9653S-50B-AM v 2000 esd electrostatic discharge( * ) * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. min. ligitek electronics co.,ltd. property of ligitek only unit urf(s) ratings page 2/5 symbol parameter absolute maximum ratings at ta=25 ma ma mw a 70 90 210 10 -40 ~ +100 -40 ~ +85 i f i fp pd ir forward current power dissipation reverse current @5v peak forward current duty 1/10@10khz tstg storage temperature operating temperature t opr min. typ. 4.918 8.2 max. 202.03.0 dominant wave length dnm viewing angle 2 1/2 (deg) spectral halfwidth nm lens emitted color water clear red part no L12URF9653S-50B-AM material algainp typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 luminous intensity vs. temperature ambient temperature( ) l u m i n o u s i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) l u m i n o u s i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 0 0 50 100 150 050100150 0.0 1.0 2.0 3.0 -40-200204060 0.51.01.52.0 80100 0.94 -20 -4040 20 080100 60 0.8 0.0 0.2 0.4 0.6 1.0 1.2 urfs chip page 3/5 fig.2 luminous intensity vs. forward current 5.0 4.0 6.0 2.53.0 0.96 0.98 1.00 1.02 1.04 1.06 0 550600650700 0.5 1.0 part no. L12URF9653S-50B-AM
note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. page 4/5 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. L12URF9653S-50B-AM 5 /sec max 0 60 seconds max preheat 0 50 120 25 2 /sec max 100 time(sec) 150 temp( c) 260 260 c3sec max
mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.t.sol=260 5 2.dwell time= 10 1sec. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solder resistance test this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 ligitek electronics co.,ltd. property of ligitek only this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) thermal shock test high temperature high humidity test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature storage test low temperature storage test operating life test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: test itemtest condition mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 page 5/5 description reference standard part no. L12URF9653S-50B-AM
|
